Sintering Press Device "X-SINTER P200X Series"
High-reliability joining technology for power electronics components! We will send a video of the device to those who are interested!
Are you facing issues such as 'voids that are likely to occur, which reduce heat dissipation and joint reliability' or 'the inability to uniformly bond chips and substrates of different heights'? Our product can press all components on the substrate (thermistors, IGBTs, MOSFETs, dies, chips, etc.) individually with dedicated pressure. We provide integrated bonding solutions for sintered dies and clips on DBC, DBA, AMB, and even sintered packages on heat sinks. [Features] - Silver sintering - Copper sintering - Micro-punch system reduces component waste - Guarantees high performance, long lifespan, and excellent reliability for the entire package - Capable of pressing all components on the substrate individually with dedicated pressure *For more details, please refer to the PDF document or feel free to contact us.
- Company：Found Four
- Price：Other
